MIC AISP 2020年第四季台灣智慧型手機產業產銷暨重要趨勢分析

前言

供應鏈部分，上游端晶圓代工產能吃緊，包括Wi-Fi 6模組、PA功率放大器、電源管理IC等關鍵零組件，以及SOI（互補式金屬氧化物半導體）、基板、SMD（表面黏著元件）、石英晶體等原物料均面臨缺料狀況，追料與產能協調以供應市場火熱需求為當前供應端關注方向，然而供貨缺口可能延續至2021年第一季，供不應求將帶動原物料價格上漲。

Taiwanese Smartphone Shipment Volume, 3Q 2018 - 3Q 2021
Taiwanese Smartphone Shipment Value and ASP, 3Q 2018 - 3Q 2021
Taiwanese Smartphone Shipment Volume by System Technology, 2Q 2017 - 3Q 2020
Taiwanese Smartphone Shipment Share by System Technology, 2Q 2017 - 3Q 2020
Taiwanese Smartphone Shipment Volume by Price Point, 2Q 2017 - 3Q 2020
Taiwanese Smartphone Shipment Share by Price Point, 2Q 2017 - 3Q 2020
Taiwanese Smartphone Shipment Share by Operating System, 2Q 2017 - 3Q 2020
Taiwanese Smartphone Shipment Volume by Display Types, 2Q 2017 - 3Q 2020
Taiwanese Smartphone Shipment Share by Display Types, 2Q 2017 - 3Q 2020
Taiwanese Mobile Phone Shipment Volume by Panel Size, 2Q 2017 - 3Q 2020
Taiwanese Mobile Phone Shipment Share by Panel Size, 2Q 2017 - 3Q 2020
Taiwanese Smartphone Shipment Volume by Shipment Destinations, 2Q 2017 - 3Q 2020
Taiwanese Smartphone Shipment Share by Shipment Destinations, 2Q 2017 - 3Q 2020
Taiwanese Smartphone Shipment Volume by Production Locations, 2Q 2017 - 2Q 2020
Taiwanese Smartphone Shipment Share by Producation Locations, 2Q 2017 - 3Q 2020
Intelligence Insight
Research Scope & Definitions

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推薦報告

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