1.Key Issues Analysis
1.1 IC Design
1.1.1 Global Smartphone Market Sees Moderate Recovery with Strong 4G Demand in Emerging Markets
1.1.2 AI PCs See Gradual Growth Momentum; PC Component Suppliers Perform Well
1.2 IC Manufacturing
1.2.1 End-Product Peak Season Boosts Chip Demand, Driving Foundry Utilization Rates
1.2.2 Weak Demand Pressures Market Prices, Cooling Memory Sales for Taiwanese Manufacturers
1.3 IC Packaging and Testing (OSAT)
1.3.1 Packaging and Testing Firms Adjust China Operations to Address Geopolitical and Industrial Changes.
1.3.2 Communication Applications Show Moderate Demand Recovery, Boosting Related Packaging and Testing Revenues
2. Industry Outlook
2.1 IC Design
2.1.1 Year-end Outlook Remains Cautious, Though Long-Term Demand Appears Optimistic
2.1.2 Consumer Market Shows Slow Recovery with Flat Demand Impacting Prices and Margins; DDIC Players Diversify to Stay Competitive
2.2 IC Manufacturing
2.2.1 Wafer Foundry Capacity Utilization Expected to Rise in 2025
2.2.2 Emerging AI and High-Performance Computing Trends Drive Demand for Advanced Testing Solutions
2.3 IC Packaging and Testing
2.3.1 Automotive Chip Inventory Adjustments Continue, Future Momentum Depends on Demand Recovery
2.3.2 AI and HPC Trends Boost Demand for Advanced Testing
Appendix
List of Companies