Development of Semiconductor Packaging and Testing in China

Freescale Semiconductor's Development

Qimonda Technology's Development

RFMD Beijing's Development

Shenzhen STS Micro-Electronics' Development

Shanghai Matsushita Semiconductor's Development

Intel Product's Development

Nantong Fujitsu Microelectronics' Development

Changjiang Electronics' Development

STATS ChipPAC's Development

MIC Perspective

Appendix

ANST, ASE (Shanghai), Changjiang Electronics, China Resources Microelectronics (Holdings), Freescale Semiconductor, Fujitsu Limited Japan, General Semiconductor (China), Giemin Electronics, Hangzhou Youwang Electronics, Hitachi Semiconductor (Suzhou), Hua Yue Microelectronics, HuaXu Microelectronics, Huayue IC Packaging, Hynix-ST Semiconductor, Hyundai Electronics (Shanghai), IBM, Infineon, Intel, Intel Products (Shanghai), Intel Technology Development (SH), International Rectifier, Jiangsu Syber Electronic, Jiangyin Changdian Advanced Packaging, Kingston Technology, Leshan Phoenix Semiconductor, Leshan Radio, Lianyungang Huawei Electronic Group, Micron Semiconductor, Micron Technology, Motorola, Nantong Fujitsu Micro, Nantong Huada Microelectronics, National Semiconductor (Suzhou), NFME, Ningbo Kangqiang Electronics, Nokia, NXP, Panasonic, Payton Technology, Qimonda (Suzhou), Qingdao Hisense Communications, Renesas Technology, RF Micro Devices, Sanyo Semiconductor, SGNEC, Shanghai Electronics Development Holding Group, Shanghai Kai Hong Electronics, Shanghai Matsushita Semi, Shanghai Simconix, Shenzhen STS Micro, SHIC, Silan Microelectronics, Siliconware (Suzhou), SIMS, Sino-Microelectronics, SMIC, SMSC, Stats ChipPAC, STMicro, Suzhou Hanlin, Suzhou Kinglong, Tianshui Huatian Microelectronics, Toshiba Semiconductor, Unisonic Technologies, Wuxi China Resources Huajing Microelectronics, Wuxi-KEC Semiconductor, Xiamen Union Development, Xiamen Yonghong Electronic, Yangzhou Jinglai Electronics, Yangzhou JingShi High Technology

Figure 1  Chinese Semiconductor Packaging and Testing Industry Revenue, 2002 - 2006

Figure 2  Freescale Semiconductor (China) Revenue from Packaging and Testing, 2002 - 2006

Figure 3  RFMD (Beijing) Revenue, 2004 - 2006

Figure 4  Shenzhen STS Micro-Electronics Revenue, 2002 -2006

Figure 5  SIMS Revenue, 2002 - 2006

Figure 6  Intel Products (Shanghai) Revenue, 2002 -2006

Figure 7  Nantong Fujitsu Microelectronics Revenue, 2002 - 2006

Figure 8  Changjiang Electronics Revenue, 2002 - 2006

Figure 9  STATS ChipPAC (Shanghai) Revenue, 2002 - 2006

Table 1  China's Top-ten Semiconductor Packaging and Testing Companies in 2006

Table 2  China's Main Packaging and Testing Makers in 2007

Table 3  Freescale's R&D and Production Locations

Table 4  Qimonda AG's R&D and Production Locations

Table 5  STMicro's R&D and Production Locations in China

Table 6  Matsushita Electric Industrial's Packaging and Testing Facilities in China

Table 7  Intel's R&D and Production LocationsI in China