Semiconductor
SMIC-JCET Strategic Cooperation on Wafer Bumping and Its Effects on the Global Semiconductor Industry
April 29, 2014 / Yaru Shih
13 Page, Topical Report
US$880 (Single User License)

Abstract

In the wake of the declaration made by China's government to make efforts to build an indigenous semiconductor industry in February 2014, SMIC (Semiconductor Manufacturing International Corporation) - China's leading wafer foundry - and JCET (Jiangsu Changjiang Electronics Technology Co.) - the leading packaging service provider in China - announced that they will jointly build an 12" bumping and testing facility, in which SMIC and JCET holds 51% and 49% stake, respectively. This report points out the reasons behind the SMIC-JCET cooperation and provides in-depth analysis of China's rise and the consequences thereof for the global semiconductor industry.
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