Semiconductor
Review on the Development of Cross-Strait Semiconductor Industries in 2013
March 28, 2014 / Yaru Shih / Chung-Yu Yang / Chun-Yu Chang
33 Page, Topical Report
US$2,300 (Single User License)

Abstract

Driven by the Chinese government's preferential policies and enormous domestic market needs, international semiconductor vendors have constantly set up plants in China to strengthen their deployment. The movement has also contributed to the development of Chinese IC design houses, manufacturers, and packaging and testing vendors. As a result, the Chinese semiconductor industry has seen stunning growth since 2010, posing serious threats to the development of the Taiwanese semiconductor industry. This report will analyze the current status of Taiwanese and Chinese semiconductor industries as well as the existing and future development of the sub-industries in Taiwan and China.
  •  Table of Contents
  •  List of Topics
  •  List of Figures
  •  List of Tables

The worldwide semiconductor market will continue to grow in 2014; however, the Taiwanese semiconductor industry will face more intense competition. While the IC design industry will be challenged by emerging Chinese vendors, IC manufacturers will face competition from international vendors in terms of process technology. Hence, the growth momentum will weaken in 2014. Taiwanese semiconductor industry value is estimated to grow 9% year on year in 2014, reaching US$65.8 billion.

Competition of IC Design for Smart Handheld Devices Intensifies

Looking to 2014, competition between Chinese and Taiwanese IC design industries will continue to focus on cellular baseband IC and tablet application ICs. The competition will then extend to power management ICs and wireless communications ICs.

Besides constant launches of competitive mid-range and value-line products featuring advanced specifications and low prices, MediaTek announced that its TD-LTE SoC (System on Chip) boasting four ARM Cortex-A17 plus four Cortex-A7 CPUs would start sampling in February 2014. With this price-competitive product, MediaTek has attempted to seize a share of the market dominated by Qualcomm. As the Chinese market accounts for 70% of MediaTek's cellular baseband IC revenue, MediaTek has shifted focus to mid-range and high-end models since 2013 to reduce the impact of its disadvantageous position when competing with Chinese IC vendors which have gained significant support from the government. MediaTek hopes the strategy will enlarge its technological gap with Chinese counterparts. Currently, integration of baseband ICs, application ICs, and wireless technologies has remained to be MediatTek's biggest competitive edge.

In line with Huawei's growing brand, Hisilicon has concentrated on providing products for Huawei. With market expansion in mind, Hisilicon started to provide sampling products to overseas vendors; some Taiwanese tablet contract makers have been evaluating the possibility of using Hisilicon's chips. Spreadtrum is still catching up with Taiwanese competitors in terms of technology development. The company's product launch schedule will depend on the Chinese government's policies and its product positioning. After being acquired by Tsinghua Unisplendour, Spreadtrum's product competitiveness will hinge on its integration capabilities for application ICs and wireless chips.

In the smart handheld device market, while power management ICs are mainly provided by Chinese IC design houses at this moment, price competition will heat up as Taiwanese power management IC vendors have expanded their product line-ups from PCs to TVs and smart handheld devices.

Increased Competition in 28nm Process Technology with Steady 8-inch Wafer Demand

Driven by smart handheld device demand and emerging products such as wearable devices, adoption of advanced 28nm process technology will increase. Since the technology provides a higher unit price, the increased adoption of the process will boost industry value. TSMC's 28nm process accounted for nearly 30% of its total revenue in 2013. Currently, most Chinese IC manufacturers still lag behind Taiwanese counterparts in 28nm products due to their slow progress in process shrink and are thus kept outside the mobile device market with strong growth potential. However, SMIC has planned to move onto 28nm production in the second half of 2014. Once Chinese vendors adopt 28nm process technology, they will stand a higher chance to win Chinese and international IC design houses' orders as they will be able to reduce contract manufacturing costs through the government's financial aids. As a result, competition at 28nm will intensify.

While wafer fabrication continues to head towards 12 and 18 inches, not all chips use 12-inch wafers. Sometimes, using 8-inch wafers are more cost-effective such as power management ICs and panel drier ICs. However, Taiwanese manufacturers have stopped expanding their 8-inch production lines. With limited production capacity, Taiwanese 8-inch fabs usually operate at full capacity utilization. Chinese vendors currently have fifteen 8-inch production lines. Although 8-inch lines use lower-level process technologies, the products also have lower profit margins, and therefore reduce international IC manufacturers' intention to secure orders for 8-inch products. As a result, the steady demand for 8-inch wafers will benefit Chinese IC manufacturers' future development.

Appendix

Glossary of Terms

CMOS

 

Complementary Metal–Oxide Semiconductor

CPU

 

Central Processing Unit

DRAM

 

Dynamic Random Access Memory

EMS

 

Electronics Manufacturing Services

FC CSP

 

Flip Chip Chip-Scale Package

IC

 

Integrated circuit

IDM

 

Integrated Device Manufacturer

LTE

 

Long Term Evolution

MCU

 

Microcontroller Unit

OS

 

Operating System

OSAT

 

Outsourced Assembly and Test

SiP

 

System in Package

SoC

 

System on Chip

TD-LTE

 

Time-Division Long-Term Evolution

TD-SCDMA

 

Time Division Synchronous Code Division Multiple Access

WL-CSP

 

Wafer Level Chip-Scale Packaging

WVGA

 

Wide Video Graphics Array


List of Companies

Allwinner Technology

   

APS

   

ASE

   

ASE Assembly & Test

   

ASEN Semiconductors

   

Casio Micronics

   

CEC Huada Electronic Design

   

Cension Semiconductor Manufacturing

   

China Integrated Circuit Design Center

   

China Resources Microelectronics

   

Chipbond

   

ChipMOS

   

Elpida

   

FATC

   

Freescale Semiconductor

   

Fujitsu

   

Galaxycore

   

Global Unichip

   

Globalfoundries

   

Grace Semiconductor Manufacturing

   

Greatek Electronic

   

HHGrace

   

Himax

   

Hisilicon

   

Hitech Semiconductor

   

HJTC

   

Hua Hong NEC

   

Huawei

   

Ilitek

   

Infineon

   

Inotera Memories

   

Intel

   

Jiangsu Changjiang Electronics Technology

   

Jilin Sino-Microelectronics

   

KYEC

   

Leadcore Technology

   

Lingsen Precision Industries

   

Macronix

   

MediaTek

   

Micron

   

Microsoft

   

MStar

   

Nantong Fujitsu Microelectronics

   

Nantong Huada Microelectronics

   

Nanya Technology

   

Novatek

   

Nufrontsoft

   

Nuvoton Technology

   

Orisetech

   

OSE

   

Phison Electronics

   

Powerchip

   

Powertech Technology

   

Qualcomm

   

Raydium Semiconductor

   

RDA Microelectronics

   

Realtek

   

Renesas Electronics

   

Rexchip

   

RF Micro Devices

   

Richtek Technology

   

Rockchip

   

Samsung

   

Shanghai Matsushita Semiconductor

   

Shanghai Huahong Grace Semiconductor Manufacturing

   

Shanghai HuaLi Microelectronics

   

Shanghai Kai Hong Electronic

   

Shenzhen High Tech Industrial Company

   

Silan

   

SK Hynix

   

SMIC

   

SMIT

   

SPIL

   

Spreadtrum

   

ST

   

Taiji Industry

   

Teramikros

   

Texas Instruments

   

Toshiba

   

Tsinghua Unisplendour

   

TSMC

   

UMC

   

Vimicro

   

VIS

   

WAE

   

Walton Advanced Engineering

   

Winbond

   

Wuxi Tongzhi Microelectronics

   

Yang Ding Tech

   

Zhonghuan Semiconductor

   

 



 

 

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