Semiconductor
The Taiwanese IC Packaing & Testing Industry, 3Q 2013
November 13, 2013 / Sagitta Pan
7 Page, Radar
US$550 (Single User License)

Abstract

In the first half of 2013, shipment value of the Taiwanese IC packaging and testing industry reached US$5.89 billion, up 4.7% year on year. Driven by the robust growth in mobile communications products and display panel driver ICs, the industry's shipment value in the second quarter arrived at around US$3.11 billion, up 11.8% sequentially and 4.9% year on year. With the increasing shipments of smart handheld devices and DRAMs, the industry's shipment value is expected to continue to advance in the second half of 2013.
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