Companies covered 3S, AAT, Acard, AIC, Alcor Micro, Ali, Alpha Imaging, Alpha Microelectronics, AMAZING, AME, AMICCOM, Amkor, AMPI, Anpec, APEC, Ardentec, ARM, Asix, ASMedia, Aspeed, Averlogic, AVID, Cadence, Champion (CMC), Chingis, Chipbond, ChipMOS, Cmedia, Davicom, Dongbu, EDA, EETI, EMC, eMemory, ENE, Episemi, ESMT, Etron, Faraday, FATC, Feeling Technology, FocalTech, Foxconn, Generalplus, Genesys Logic, Giga Solution, GlobalFoundries, GMT, GUC, Hana Micron, Himax Technologies, Hisilicon, Holtek, Hua Hong, Hycon, IC Plus, Ilitek, Inotera, JCET, J-Device, KYEC, Leadtrend, Lingsen, Liteon Semiconductor, Macroblock, Macronix International, Marvell, MediaTek, Megawin, Micron, Myson Century, Nanya Technology, Niko-Sem, Novatek, Nuvoton, Nvidia, Orise Technology, OSE, Phison, PixArt, Powerchip, Prescope, Princeton, Prolific, PTC, PTI, Qualcomm, RDC, Realtek, Renesas SP, Richtek, Samsung, Semiteq, ShunSin, Signetics, Siguard, Silicon Motion, SiS, SiTI, Sitronix, SK Hynix, Skymedi, SMIC, Sonix, SPIL, Spreadtrum, SQ Technology, STATS ChipPAC, SummitView Capital, Sunplus, Synaptics, Syntek, Sysnopsys, Test-Serv Inc., TIPC, Tmtech, Tontek, TowerJazz, UltraChip, UMC, Universal Scientific Industrial Co., UTAC, Vate Technology, VIA, VIS, V-TAC, Walton, Weltrend, Winbond, X-FAB, Xintec, YTEC, Zentel