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Semiconductor - Semiconductor

The Future of eNVM: Application Markets, Market Forecasts and Major Trends

September 26, 2014 / Chris Hung / Yaru Shih

16 Page, Topical Report

US$2,000 (Single User License)

Abstract

The rapid rise of smart handheld devices, smart wearables, and IoT (Internet of Things) has driven the need for chipsets that have high integration and low power consumption capabilities. In addition to SiP (System in Package) and SoC (System on Chip), the industry has been seeking other embedded memory technologies and eNVM (embedded Non-Volatile Memory) solutions in particular have been drawing significant attention. This report investigates the development of logic eNVM including OTP/MTP solutions, in smart wearables and IoT and examines its future potential thereof.

Table of Contents
1. Development of eNVM Application Markets
1.1 Smart Wearable Applications
1.2 Smart Network Applications
2. Development of eNVM Technology
3. Development of eNVM Solution Providers
4. Potential Challenges Facing eNVM
5. Conclusion
5.1 Competition Heating Up Among All eNVM Solution Providers
5.2 Demand for MTP Solutions to be Key Growth Driver
Appendix

List of Topics
Development of eNVM technology and its application markets covering smart wearable devices and smart networks, known as IOT

Highlight of eNVM OTP and MTP technology solutions, touching on how much OTP and MTP differ in term of cell structure, erase format, storage volume, technology maturity, and reprehensive firms

Rankings of top-20 patent applicants filed for eNVM and includes the number of applications per individual applicant

Pros and cons of eNVM technology development in the future

List of Figures
Figure 1 Worldwide Smart Wearable Market Volume, 2013 - 2018
Figure 2 Market Volume of Smart Handheld Devices and IOT Devices in 2009 versus. 2020
Figure 3 Top 20 eNVM Patent Applicants, 1998 - 2013

List of Tables
Table 1 Comparison of NVM Technology Solutions
Table 2 Rankings of Top-20 eNVM Patent Applicants

Companies covered
Apple, Atmel, Broadcom, Cambridge Enterprise, Chingus, eMemory, Epson, ESMT, Etron, FlashSilicon, Freescale Semiconductor, GlobalFoundries, Headwater Partners, IBM, Identifi Technologies, Impinj, Infineon, Inotera, Intel, Kilopass, Koninkl Philips, Lattice Semiconductor, Macronix, Mag Instrument, Marvell Technology, Micron Technology, Microsoft, Monolithic, Monolithic System, MoSys, Motorola, Nanya, Novocell Semiconductor, NXP BV, Panasonic, Parker Hannifin, Philips, Phison Electronics, R828 LLC, Renesas, Samsung, SanDisk, SenCal LLC, Sidense, SMIC, Socket Mobile, Sony, Spansion, SST, STMicro, Synopsys, Texas Instruments, Tower Semiconductor, TSMC, UMC, Unity Semiconductor, Virage Logic, Winbond, Xilinx, YMC, Zilog

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