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Research Reports

Mobile World Congress 2014 Observations: 4G LTE Chips

March 28, 2014 / Richard CT Wong

8 Page, Radar

US$550 (Single User License)

Abstract

Mobile phone IC solution providers, like always, sought the opportunities to presenting their latest products at MWC (Mobile World Congress) 2014 for enhanced brand awareness. This year, 4G LTE (Long Term Evolution) chips received the highest attention at the exhibition and many of products running on the latest LTE chips were demonstrated as well. Chipmakers participated this year include Qualcomm, Intel, MediaTek, Marvell, Nvidia, Broadcom, GCT, Sequans, Altair and Hisilicon. This report profiles mainly the latest offerings of major chipmakers and possible cooperation models surrounding around 4G LTE chips are examined.

Table of Contents
1.New Chips for Smartphones Proliferating
2.More Client-side Terminals Parining with LTE Chips and COE SoC Solutions Becoming Available
3.Conclusion
3.1 LTE Chips Unleashed to Accelerate Mid-to-low-end LTE Smartphone Development
3.2 Wireless Networking Device Providers Aim for Increased Product Differentiation with LTE Chips
Appendix

List of Topics
Background introduction, touching on LTE chip products released by major chip suppliers at MWC2014

Chip process technology enhancement, especially products released by Qualcomm, Intel, MediaTek, Marvel, Nvidia, and Broadcom, as well as Chinese counterparts

More client-side terminals pairing with LTE chips, future development of the said terminals and major suppliers

Companies and organizations analyzed or mentioned in the report include: Altair, Broadcom, GCT, Hisilicon, Innofidei, Intel, KT, LeadCore, Marvell, MediaTek, Nvidia, Qualcomm, Renesas, Samsung, Sequans, SKT, Spreadtrum

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