Abstract
In 2003, MIT's Technology Review included WSN (Wireless Sensor Network) technology in its list of ten important new technologies that would change the world. Commercial testing of WSN systems began in 2004. It is forecasted that, by 2008, global WSN node shipment volume will exceed 100 million units per year, with shipment value topping US$2 billion. 60% of these nodes will be compliant with the ZigBee specification, which was ratified in 2004 and has spawned various applications since. With the low-cost SiP/SoC ZigBee ICs entering volume production, it is expected that the global ZigBee IC shipment volume will achieve a CAGR of around 200% over the period 2004 - 2009. It is expected that the annual ZigBee IC shipment volume will reach 150 million units by 2009, representing significant business opportunities. This report will examine the current applications for ZigBee technology in the WSN segment.
It is expected that sales of WSN equipment using ZigBee technology will grow strongly in 2007. One important factor is that the leading ZigBee chip suppliers have been rolling out SiP/SoC chips to make their products more competitive in terms of cost. As a result, price per chip has fallen to under US$3. Besides providing wireless transmission function, these SiP/SoC products can also serve as the MCU for the controller device. From the equipment maker's point of view, these products offer several important new capabilities at very little extra cost, usually less than US$2.
A second factor boosting growth in the WSN market is the commencement of volume production for a wide range of different types of MEMS (Microelectromechanical System) products. MEMS components are widely used in sensor products. New types of MEMS that can now be manufactured in large quantities include MEMS for measuring temperature and three-axis acceleration sensor. Applications for temperature measurement MEMS include the measurement of outdoor temperature by smart air-conditioning systems to determine the most suitable indoor temperature, so as to prevent energy from being wasted due to an excessively high difference between indoor and outdoor temperature. Three-axis acceleration sensors can be used in controllers, such as the controller for Nintendo's Wii game console. The Wii went on sale in Japan in November 2006, and by February 2007, more than 1.4 million had been sold in the Japanese market alone. One of the main reasons for Wii's success is the user-friendly controller design. The Wii controller is one of the most successful examples of the application of wireless sensor technology to consumer electronics. The three-axis acceleration sensor in the Wii controller incorporates a low-energy-consumption MEMS chip that is able to provide precise speed values for three axes. Using star-type network topology, the data from the three-axis acceleration sensor is transmitted back to the Wii console to ensure smooth operation of the whole system. Bluetooth is used for the wireless interface.
A third factor expected to contribute to rapid growth in the WSN market in 2007 is ZigBee 2007, the third version of ZigBee stack, scheduled for finalization in the first quarter of 2007. Besides eliminating bugs that affected earlier versions of ZigBee stack, ZigBee 2007 also provides improved WSN functionality. From the point of view of any company planning to develop ZigBee products, ZigBee 2007 gives them more profiles to use, which in turn means a wider range of potential applications.
Heterogeneous networks are a fourth factor. Heterogeneous networks offer greater depth and breadth in the range of applications for WSN technology. Besides integrating ZigBee with Wi-Fi, 3G (Third Generation Mobile Communications), or WLAN (Wireless Local Area Network), there is also the potential for integrating ZigBee with RFID (Radio Frequency ID) technology, which has already reached a high level of maturity. Given ZigBee's advantages in terms of network topology and cost, it could serve as a bridge between WLAN and RFID, making it possible to leverage RFID in inventory management, tracking and, positioning.
For several years now, high production costs and intense price competition have been squeezing consumer electronics vendors' profit margins. ZigBee offers consumer electronics vendors the opportunity to create more value, provided that they can work out how to leverage the technology effectively.
Appendix
Research Scope
This report analyzes the commercial activities generated by the combination of ZigBee technology with sensor network or MEMS components, focusing on the current applications for ZigBee technology in the WSN segment, related communications protocols, major players, and market status.
Product Definitions
MEMS
MEMS (MicroElectroMechanical Systems) are intelligent micro systems capable of sensing, processing, or activating functionality. A MEMS comprises two or more functions integrated on one or several chips. Applications for MEMS range widely, including manufacturing, automation, information and communications, aerospace engineering, transportation, civil engineering, environmental protection, as well as agriculture, forestry, fisheries, and livestock husbandry.
QFN
QFN (Quad Flat No-lead) is a surface-mount IC package with no leads extending from each of the four sides, commonly applied in high-speed and high-frequency IC designs. There are two types of packaging materials, ceramic and plastic. Contact spacing comes in three varieties: 1.27mm, 0.65mm, and 0.5mm.
Glossary of Terms
AES |
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Advanced Encryption Standard |
AMR |
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Automatic Meter Reading |
AODV |
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Ad-hoc On-demand Distance Vector |
BPSK |
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Binary Phase-Shift Keying |
CAGR |
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Compound Annual Growth Rate |
CSMA/CA |
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Carrier Sense Multiple Access with Collision Avoidance |
DARPA |
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Defense Advanced Research Projects Agency |
DSSS |
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Direct-Sequence Spread Spectrum |
FFD |
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Full Function Device |
IC |
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Integrated Circuit |
IEEE |
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Institute of Electrical and Electronic Engineers |
KVP |
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Key Value Pair |
LR-WPAN |
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Low-Rate Wireless Personal Area Network |
MAC |
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Media Access Control |
MCU |
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MicroController Unit |
MEMS |
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Microelectromechanical System |
O-QPSK |
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Offset Quadrature Phase-Shift Keying |
OTA |
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Over The Air |
PAN |
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Personal Area Network |
PHY |
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Physical |
PIC |
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Personal Internet Communication |
QFN |
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Quad Flat No-lead |
QLP |
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Quad Leadless Package |
RF |
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Radio Frequency |
RFD |
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Reduced Function Device |
RFID |
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Radio-Frequency Identification |
RISC |
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Reduced Instruction Set Computing |
SiP |
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System in Package |
SoC |
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System on Chip |
WLAN |
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Wireless Local Area Network |
WPAN |
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Wireless Personal Area Network |
WSN |
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Wireless Sensor Network |
ZCP |
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ZigBee Compliant Platform |
List of Companies
Airbee |
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Atmel |
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The Blackstone Group |
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CCL (Cambridge Consultants Ltd.) |
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Chipcon |
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Crossbow Technology |
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Ember |
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Figure 8 Wireless |
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Freescale |
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Hitachi |
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Honeywell |
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Integration Associates |
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III (Institute for Information Industry) |
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資策會 |
Invensys |
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Jennic |
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Korwin |
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MeshNetics |
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Microchip |
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微芯 |
Mindteck |
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Mitsubishi |
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Moteiv |
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Motorola |
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NEC |
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OKI |
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Philips |
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RadioPulse |
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Skyley Networks |
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STMicroelectronics |
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TI |
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UBEC |
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達盛 |