Research Reports
Intel, Wavesat, and Runcom's WiMAX Chipset Development Strategies
October 26, 2006 / Richard CT Wong
21 Page, Topical Report
US$1,680 (Single User License)

Abstract

The IEEE on February 28, 2006 announced the 802.16e-2005 standard, and WiMAX products started a transition from fixed broadband access to mobile broadband access. WiMAX chipsets are important links in overall WiMAX product development. Currently, several ODM makers of WiMAX equipment use WiMAX chipsets from Intel, Wavesat and Runcom. This report will analyze Intel, Wavesat, and Runcom's WiMAX chipset development strategies.
  •  List of Figures
  •  List of Tables

Several 802.16-2004 chips have integrated UMAC processors and some 802.16e-2005 baseband chips have built-in PHY and MAC layers and UMAC layer processors. In the future, handheld devices will be a major driver behind WiMAX chip growth. The chip suppliers may use different packaging methods to integrate RF transceivers and basebands to maintain baseband chip design flexibility and meet equipment makers' demand for smaller chip sizes and an overall solution.

Because Intel dominates the market for notebook PC CPUs, the company will use this advantage to promote use of its WiMAX chips. Intel will also use its WiMAX chips to consolidate its position in the CPU market, and the company will aim its next-generation chips at the notebook PC market. Its ultimate target is to use WiMAX chips in notebook PCs as part of the Centrino standard. Moreover, because Intel has Wi-Fi chips in its portfolio, the company is likely to offer dual-mode WiMAX/Wi-Fi products.

Wavesat will also start by developing the notebook PC market, but it does not dominate in this market. Wavesat will focus on external equipment for notebook PCs such as PCMCIA cards, and as its next step will target the USB terminal market.

Because Runcom is strong in 802.16e chip technology and was the first to cooperate with Korea Telecom, its product positioning is mainly in the mobile phone market, and it supports a number of consumer electronics interfaces.

Appendix

Glossary of Terms

BPSK

 

Binary Phase Shift Keying

BS

 

Base Station

BWA

 

Broadband Wireless Access

CPU

 

Central Processing Unit

FDD

 

Frequency Division Duplex or Duplexing

H-FDD

 

Half-duplex Frequency Division Duplex

IC

 

Integrated Circuit

MAC

 

Medium Access Control Layer

ODM

 

Original Design Manufacturing

OFDM

 

Orthogonal Frequency Division Multiplexing

OFDMA

 

Orthogonal Frequency Division Multiple Access

PHY

 

Physical Layer

QAM

 

Quadrature Amplitude Modulation

QPSK

 

Quadrature Phase-Shift Keying

RF

 

Radio Frequency

SLIC

 

Subscriber Line Interface Circuit

SOC

 

System On Chip

TDD

 

Time Division Duplex or Duplexing

TDM

 

Time Division Multiplexing

UMAC

 

Up Layer Medium Access Control


List of Companies

Air Broadband

 

 

Airspan

 

 

Alcatel

 

 

Alpha Network

 

 

Alvarion

 

 

Aperto

 

 

Asustek

 

 

Atmel

 

 

Beceem

 

 

Delta Networks

 

 

Ericsson

 

 

Fujitsu

 

 

Gemtek

 

 

Huawei

 

 

IEEE

 

 

Intel

 

 

Jstream

 

 

Korea Telecom

 

 

LGE

 

 

MiTAC

 

 

Motorola

 

 

Nokia

 

 

Nortel

 

 

Philips

 

 

picoChip

 

 

Proxim

 

 

Redline

 

 

RF Magic

 

 

Runcom

 

 

Samsung

 

 

Sequans

 

 

SiGe

 

 

SK Telecom

 

 

Skypilot

 

 

Sloka Telecom

 

 

SMI

 

 

SR Telecom

 

 

TeleCIS

 

 

Terabeam

 

 

TI

 

 

WaveIP

 

 

Wavesat

 

 

Z-Com

 

 

ZTE

 

 

ZyXEL

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