Research Reports
The Korean Mobile Phone Industry, 1H 2004 and Beyond
August 23, 2004 / Shan-Tung Wu
33 Page, Statistics Report
US$1,620 (Single User License)

Abstract

In the first half of 2004, Korean handset export volume reached 70 million units while export value stood at US$8 billion. However, underneath this record performance lied dramatic changes in competitive dimension and industry structure. Samsung rolled out a full range of handsets in a departure from its high-end tactics. LG attempted to gain a strong foothold in the 3G market. Pantech decided to set up six sales outlets across the US for its branded business. On the other hand, second-tier makers faced an uncertain future after their foray into the Chinese market proved unsuccessful. Makers such as Sewon and Telson thus filed for bankruptcy in May and July 2004 respectively. The Korean mobile phone industry is again entering a phase of restructuring.
  •  List of Topics
  •  List of Figures
  •  List of Tables

In the first half of 2004, Korean export share of camera phones and color display handsets rose, and second-tier makers expanded their presence into Europe, North America, and Latin America. Total handset export value thus registered explosive growth. However, this high performance painted drastically different pictures for first-tier and second-tier makers.

First-Tier Makers See Positions Consolidated

In addition to high-end handsets, Samsung expects to reinforce its mid-range and value-line rollouts to capture larger global market share and replace Motorola as the second largest handset vendor worldwide. The strategic move is anticipated to affect handset makers that concentrate on the mid-range and value-line segments. 

LG is aiming to consolidate its 3G handset business and attain larger share in the North American and European markets. The CDMA sector is also expected to be further cultivated.

Pantech is expected to focus resources on the North American market. Although Pantech announced plans to set up six sales outlets after the attempt to buy Audiovox, its growth was curbed by the setback to some extent. While Pantech continues to receive orders from Motorola and focuses on the markets in China and Latin America, Pantech & Curitel is expected to drive branded business in Korea, North America, and Europe.

Second-Tier Makers Face Mounting Hurdles

Unlike leading handset vendors, second-tier makers face stern challenges ahead. Sewon and Telson have been seeking opportunities for comeback since they filed for bankruptcy in May and July 2004 respectively. Both makers' competitiveness was severely undermined due to their concentration on contract production and high reliance on the Chinese market. Coupled with a brain drain, Sewon and Telson have become unfavorable targets for potential buyers. The outlook for small Korean design houses also looks dismal.

All these changes are converging to reshape the texture of the Korean mobile phone industry. Leading vendors are now offering traction for the industry growth with their global networks and vertical integration. While Sewon and Telson face a difficult future, other second-tier makers are expected to retreat from the long-cultivated Chinese market. They are looking to other regional markets where first-tier makers have less presence, such as Russia, India, Middle East, Eastern Europe, and Latin America. However, challenges abound for these second-tier Korean makers as they will eventually face stiff competition in these markets.

Glossary of Terms

BRIC

 

Brazil, Russia, India, and China

CCD

 

Charged Coupled Device

CCM

 

Compact Camera Module

CDMA

 

Code Division Multiple Access

CIS

 

CMOS Image Senor

CMOS

 

Complementary Metal-Oxide Semiconductor

DMB

 

Digital Multimedia Broadcasting

EDGE

 

Enhanced Data rates for Global Evolution

GSM

 

Global System for Mobile Communications

HDD

 

Hard Disk Drive

IC

 

Integrated Circuit

LCD

 

Liquid Crystal Display

LED

 

Light Emitting Diode

MNP

 

Mobile Number Portability

MP

 

Megapixel

ODM

 

Original Design Manufacturer

OLED

 

Organic Light Emitting Diode

PCB

 

Printed Circuit Board

PCS

 

Personal Communications Services

PDA

 

Personal Digital Assistant

SARS

 

Severe Acute Respiratory Syndrome

SoC

 

System on Chip

TDMA

 

Time Division Multiple Access

TFT

 

Thin-Film Transistor

WCDMA

 

Wideband Code Division Multiple Access

Wi-Pi

 

Wireless Internet Platform for Interoperability

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