Companies covered AAC Technologies, Accelink Technologies, Amphenol, AMS AG, Apple, Arm, ASML, Avary, BOE, Broadcom, BYD, Dialog Semiconductor, Focaltech, Garuda Technology, Goertek, Goodix, Google, Hengtong Optic-electric, Hisilicon, Huizhou Speed Wireless Technology, Infineon Technologies, InnoLight, Intel, Kantatsu, Kioxia, Kyocera, Lam Research, Largan, LG, Luxshare, Macronix, Maxscend Microelectronics, MediaTek, Micron, Microsoft, Mitsubishi Electric, Murata, Nanya, Novatek, Nvidia, NXP Semiconductor, O-film Tech, O-Net Technology, Oppo, Qorvo, Q-Tech, Qualcomm, Renesas, RichWave, Rohm Semiconductor, Samsung, San’an Optoelectronics, Shennan Circuits, Shenzhen Luxshare Precision, Shenzhen Sunway Communication, Sichuan Haite High-Tech, SK Hynix, Skyworks, SMIC, Sony, STATS ChipPAC, STMicroelectronics, Sunlord Electronics, Sunny Optical, Sunwoda, Taiyo Yuden,
TCL, TDK, TI, Tianma Microelectronic, Tianshui Huatian Technology, Tongfu Microelectronics, Toshiba, Toshiba Memory, TSMC, Vivo, Willsemi, Windbond, Wus Printed Circuit, Xiaomi, Xilinx, Yangtze Optical Fiber and Cable