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The Worldwide Motherboard Application IC Market, 3Q 2012
October 26, 2012 / Chun-Yu Chang
16 Page, Statistics Report
US$1,750 (Single User License)

Abstract

This research report presents forecast and recent quarter review of the worldwide motherboard application IC market. The report includes motherboard shipment volume and breakdowns by CPU supplier, CPU connector type, chipset supplier, and chipset type. The content of this report is based on primary data obtained through interviews with motherboard component makers. This report finds that the industry's shipment volume posted a sequential growth but a year-on-year decline in the third quarter of 2012. Regarding CPU connector type, it is observed that the Socket 2011 is gradually replacing Socket 1366 since its launch in the fourth quarter of 2011. It is projected that the worldwide motherboard shipment volume will begin to drop sequentially in the fourth quarter of 2012, and will continue to be on the decline in the first and second quarter of 2013.
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