Examination of the success in policies toward creating more financing channels, promoting an industry cluster effect; national ICT promotion plans and derivative chip rollouts; evolution of the Chinese government's IC industry policy, including a look at the history of five-year plans as they relate to IC industry, Document No. 18 and supplementary documents, regional government policies, the future direction of IC industry policy
Amkor, ASE, ASMC, BCD Semiconductor, Beijing Liuhe Wantong Microelectronics, Beijing Municipal Government, Boma Microelectronics, Chartered, Chiangjiang Electronics Technology, China Huada Integrated Circuit Design, China Huajing, ChipPAC, Datang Microelectronics Technology, General Administration of Customs, Grinm Semicon, GSMC, Shanghai Belling, Hangzhou Silan, Hangzhou Silan Integrated Circuit, He Jian Technology, Hynix, IdeaBank, Intel, Liuhe Wantong Microelectronics, Ministry of Finance, Ministry of Information Industry, Ministry of Science and Technology, Shanghai Dupont Mask, Shanghai Fudan Microelectronics, Shanghai Huahong Integrated Circuit, Shanghai Huaxi, Shanghai Municipal Government, Shanghai Xinjin, Shaoxing Huayue, Shaoxing Jingke Technologies, Shenzhen City Government, Shenzhen Guowei Electronics, Shougang Ridian, Siami Weier Microelectronics, Sigma-Jinghua Microelectronics, SMIC, SPIL, Spreadtrum, State Bureau of Taxation, State Council, State Development Planning Commission, State Economic and Trade Commission, Tongji University, TSMC, UMC, Wuxi China Resources Semico, Xian City Government, Zhanxun Communications, Zhongxing Microelectronics, Zhongxing Microelectronics