The U.S. Department of Commerce has finalized substantial funding packages under the CHIPS Act to strengthen domestic semiconductor production, allocating USD 6.1 billion in subsidies to Micron Technology, according to a December 11 report by Commercial Daily News. The funding will support the construction of three state-of-the-art memory chip factories, including a "megafab" in New York and a new facility in Idaho, with operations expected to commence between 2026 and 2029. Additionally, Micron secured an extra USD 275 million to expand its Virginia plant, which specializes in automotive and industrial chips.

 

Meanwhile, Taiwan’s GlobalWafers has received USD 406 million in U.S. government grants to enhance silicon wafer production, as reported by Reuters on December 18. This funding will support the establishment of new facilities in Texas and Missouri, enabling the first high-volume U.S. production of 300-mm wafers for advanced semiconductors and defense applications. These investments collectively highlight a strategic initiative to strengthen the nation’s semiconductor supply chain and global competitiveness.

 

The global semiconductor market is projected to reach USD 1 trillion by 2030, driven by the rising demand for artificial intelligence (AI) and high-performance computing (HPC) applications, according to the Taipei-based Market Intelligence & Consulting Institute (MIC). MIC emphasized a paradigm shift in the semiconductor industry, moving from traditional ICT-driven demand to advanced AI and HPC requirements. With Micron and GlobalWafers’ projects set to create thousands of jobs and expand manufacturing capacity, the U.S. is positioning itself to lead in critical technologies essential to AI, defense, and national security.