TSMC and Amkor Technology recently have signed a Memorandum of Cooperation (MoU) to bring advanced chip packaging and testing capabilities to the U.S., marking a milestone in strengthening America's semiconductor supply chain, according to a press release from TSMC on October 4. As part of the deal, they will collaborate to establish advanced packaging services at a planned Amkor facility in Peoria, Arizona. This partnership will support TSMC's Phoenix-based wafer fabrication operations and accelerate product cycle times. Technologies like TSMC's Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS®) will be employed to meet the needs of shared customers, particularly in the AI and high-performance computing sectors.
This collaboration aligns with the U.S. government's "Made in America" initiative, reinforcing a strong domestic semiconductor ecosystem. Both companies emphasized their commitment to innovation and supply chain resilience. TSMC highlighted the growing dependence on advanced packaging for breakthroughs in mobile applications and AI, while Amkor expressed pride in providing seamless integration of manufacturing and packaging processes to drive semiconductor advancements. This partnership strengthens TSMC's U.S. operations, expanding the range of services available to local customers.
Taiwan's semiconductor sector is projected to reach a shipment value of NT$4.76 trillion (USD 150.7 billion) in 2024, reflecting a year-on-year growth of 21.3%, according to the Taipei-based Market Intelligence & Consulting Institute (MIC). This growth is driven largely by the recovery of mainstream ICT products. MIC forecasts sector-specific growth in the following areas for 2024 compared to 2023: foundries (28%), IC design (15%), memory IC/Integrated Device Manufacturing (IDM) (18%), and IC packaging and testing (6%).