TSMC, in collaboration with the U.S. Department of Commerce, announced yesterday that its investment project in Arizona, USA, could receive up to US$6.6 billion in direct subsidies from the US government. TSMC also declared its intention to establish a third semiconductor fab in the United States, expected to adopt 2nm or more advanced processes by 2030. Following this expansion plan, TSMC's total investment in the country will exceed US$65 billion. Apart from US$6.6 billion subsidyt, TSMC could also receive up to US$5 billion in loans.
TSMC revealed that production at the first Arizona semiconductor fab using 4nm technology is set to begin in the first half of 2025, while the second fab will commence production using 2nm technology in 2028. As for the third semiconductor plant, it is projected to begin chip production using 2nm or more advanced processes by around 2029-2030.
According to the Market Intelligence & Consulting Institute (MIC), a division of the Institute for Information Industry (III), projections indicate that the Taiwanese semiconductor industry's shipment value is set to reach approximately NT$4.17 trillion (US$135.3 billion) in 2024, reflecting a robust year-on-year increase of 13.6%.