TSMC has officially announced its intention to build a second 12-inch wafer fabrication facility in Kumamoto, Japan, focusing on advanced processes such as 7nm and 6nm. Construction is slated to commence by the end of this year, with operations scheduled to begin by late 2027. The collective investment for both Japanese fabs is projected to surpass US$20 billion. Despite a lower monetary commitment compared to the US expansion, TSMC underscores the "strong support" received from the Japanese government.

The opening ceremony for TSMC's first Kumamoto fab, established through the joint venture JASM (Japan Advanced Semiconductor Manufacturing) with Sony Semiconductor Solutions and Japan's Denso, is scheduled for February 24 this year. Following Toyota's entry into JASM, TSMC, Sony, Denso, and Toyota will collectively hold around 86.5%, 6%, 5.5%, and 2% of the shares, respectively. With the establishment of both fabs, JASM's Kumamoto site is expected to achieve a total monthly production capacity exceeding 100,000 12-inch wafers. This will cater to various process technologies, including 40nm, 22/28nm, 12/16nm, and 6/7nm, targeting applications in the automotive, industrial, consumer, and high-performance computing (HPC) sectors.