Samsung Electronics has officially announced the signing of a Memorandum of Understanding (MoU) with ASML for the establishment of a new semiconductor fabrication plant. The investment, totaling 1 trillion Korean won (approximately US$760 million), reflects a collaborative effort to advance semiconductor processing technology, as reported by Commercial Daily News on December 14.

 

According to the terms of the agreement, the forthcoming facility will leverage ASML's proprietary Extreme Ultraviolet (EUV) equipment technology. This strategic move is anticipated to facilitate ASML's expanded footprint in South Korea. The company already operates four facilities in the country, serving prominent clients like Samsung.

 

In parallel with this development, ASML has forged a collaboration agreement with SK Hynix, the world's second-largest DRAM manufacturer. This partnership aims to spearhead the development of energy-efficient chip manufacturing technology.

 

The shipment value of Taiwan's semiconductor industry, comprising of IC design, wafer foundry, memory/IDM (Integrated Device Manufacturing), and IC packaging and testing industry sectors, is estimated to be NT$3.77 trillion (US$118 billion) in 2023, according to MIC. Looking ahead to 2024, it is anticipated that the industry's shipment value will reach NT$4.29 trillion (US$134.5 billion), marking an impressive growth of 13.7% year-on-year, according to MIC (Market Intelligence & Consulting Institute). Various semiconductor industry sectors are expected to experience growth ranging from 10% to 20% in 2024. Among them, the wafer foundry industry sector is anticipated to remain a primary driver, particularly in advanced manufacturing segments.