US-based IDM (Integrated Device Manufacturer) Onsemi recently announced that the company plans to initiate in-house production of CMOS image sensors (CIS) by 2024, according to Nikkei Xtech on November 11. Onsemi initially adopted a "fab lite" strategy, outsourcing the production of all its CIS solutions. The decision to bring CIS production in-house stems, however, from the supply chain instability experienced during the COVID-19 pandemic years. To ensure a more secure and stable supply chain, the company will now internally produce CIS logic circuits, encompassing 40nm and 65nm processes, with front-end processes distributed between its wafer fab in East Fishkill, New York, and the Nampa factory in Idaho. Despite this shift, Onsemi emphasizes that not all CIS products will be internally manufactured, as the company remains flexible based on market demand.

 

Onsemi's current revenue pillars are CIS and power semiconductors, with the company leading the automotive CIS sector with a 46% market share and a 68% share in the advanced driver assistance system (ADAS) CIS market. Additionally, Onsemi holds a 9% market share in power semiconductors. In the realm of silicon carbide (SiC) power semiconductors, the company focuses on vertical integration, covering the entire production process from ingot growth to device fabrication to enhance its competitive edge.

 

The global semiconductor industry is projected to grow from US$516.1 million in 2023 to US$708.4 million in 2026, according to MIC (Market Intelligence & Consulting Institute), a semi-government IT research institute in Taiwan. it is anticipated that the integration of SiC in end devices may become a major mainstream trend in the future as SiC can significantly reduce energy losses during power conversion to maximize power. Established in 1987, MIC is a division of III (Institute for Information Industry), a major government think tank, and one of the leading IT research institutes in the Asia-Pacific region.