The global wafer fab forecast report released by SEMI projects that 18 new semiconductor fabs will be established in 2025, including three 8-inch fabs and 15 12-inch fabs, as reported by Economic Daily News on January 9. Most of these facilities are expected to commence operations between 2026 and 2027.
Chipmakers are actively ramping up production capacity for advanced processes below 7nm, with a projected growth rate of 16% this year. SEMI notes that among the new fabs, four will be located in both the Americas and Japan, three in China, Europe, and the Middle East, and two in Taiwan. South Korea and Southeast Asia will each see one fab established.
According to the Market Intelligence & Consulting Institute (MIC), Taiwan's wafer foundry capacity utilization is expected to grow by nearly 10% in 2025 compared to 2024. This growth is attributed to the expectation that inventory adjustments in the consumer electronics, automotive, and industrial control sectors will reach completion. The subsequent replenishment orders are anticipated to boost demand for related chips and improve utilization rates in the associated manufacturing processes.