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Asia Express
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Samsung Electro-Mechanics to Set Up Flip-Chip Substrate Facility in Korea
July 21, 2006 / Asia Express
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LG Telecom's 3G CMDA License Revoked by Korean Government
July 21, 2006 / Asia Express
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IBM Opens First Power Application Center in Shanghai
July 20, 2006 / Asia Express
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Optical Communications Products to Acquire GigaComm
July 19, 2006 / Asia Express
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Samsung, Siltronic to Form JV in Singapore for 12-Inch Wafer Production
July 19, 2006 / Asia Express
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ECS Acquires Notebook PC Maker Uniwill
July 14, 2006 / Asia Express
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NTT DoCoMo Moving Forward with Development of Super 3G
July 14, 2006 / Asia Express
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Sumida, Shintex to Form LCM JV and Set Up Plant in Guangzhou, China
July 14, 2006 / Asia Express
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TI Announces Establishment of Second R&D Facility in India
July 14, 2006 / Asia Express
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Grace Semiconductor Establishes Subsidiary in Japan
July 14, 2006 / Asia Express
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