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Semiconductor
Taiwanese IC Packaging & Testing Industry, 3Q 2016
October 18, 2016 / Bear Hsiung
16 Page, Statistics Report
US$600 (Single User License)

Abstract

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements. The report finds that shipment value of the Taiwanese IC packaging and testing industry grew 10.9% sequentially to US$3.2 billion in the second quarter of 2016, thanks to the growing demand for chips used in IoT microcontrollers, smart car sensors and graphic cards, virtual reality headsets, and wearable devices. Benefited from Apple's launch of iPhone 7/7 Plus, IC packaging and testing service providers had seen continued growth in the third quarter. Hence, the industry's shipment value is expected to have totaled US$3.5 billion in the third quarter, up 9.8% sequentially.  
  •  Table of Contents
  •  Companies covered

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