Taiwan's leading semiconductor company UMC has unveiled a strategic partnership with Intel to jointly develop a 12nm manufacturing process platform. This collaboration leverages UMC's expertise in mature processes and Intel's extensive US manufacturing capacity. The objective is to address the growing demands in mobile, communication infrastructure, and network markets, with mass production scheduled to commence in the state of Arizona, United States, by 2027. UMC emphasizes that the 12nm process will harness Intel's significant US manufacturing capabilities and FinFET (Fin Field-Effect Transistor) design experience, creating a powerful combination.

According to Market Intelligence & Consulting Institute (MIC), a division of the Institute for Information Industry (III), the projected shipment value of the Taiwanese semiconductor industry is expected to reach approximately NT$4.33 trillion (US$140.1 billion; US$1= NT$30.8) in 2024, marking a 13.6% year-on-year increase. The foundry sector is anticipated to hold the largest share, with an expected shipment value of NT$2.49 trillion (US$80.8 billion) in the same year.