Abstract
CCMs are developing towards smaller sizes and lower costs. However, traditional CCM assembly methods are restricted by materials and technology, and there are bottlenecks in terms of product cost control. As a result, wafer-level camera modules have emerged. Wafer-level camera modules make use of semiconductor production processes to manufacture optical components, and are integrated with the image sensor. This process can enable companies to achieve their goals of making modules smaller and lowering prices. Large-scale production and low prices will threaten existing camera module makers, and could also lead to changes in the CCM industry supply chain. However, a challenge for wafer-level modules is yield rate, which will have to increase significantly before they will have a significant impact.
Yield Rate Is Key for Waver-level Modules to Capture a Share of the Market
Using wafer-level camera technology enables companies to produce several thousand lenses on a wafer, and conduct adjustments and soldering on the wafer level. This avoids problems related to manual focus when producing camera modules, shortening the production process and reducing costs.
Although waver-level camera modules have advantages of low costs and small sizes, the actual mass production yield rate still remains a challenge, as it involves areas such as lens cutting, lens design, microelectronics processing, semiconductor assembly, optical processes, and production line planning. These areas are complex and tend to feature advanced technologies. The wafer-level camera IP licensing company Tessera in recent years acquired four companies, including the wafer-level packaging company Shellcase, the WLC technology company Digital Optics, the auto-focus and optical amplifying technology company Eyesquad, and the image technology company FotoNation.
If a company wants to grasp all these technologies and have mass production capabilities, they need to make long-term investments in technology and manpower. Furthermore, the products which can currently be achieved by wafer-level camera modules are entry-level VGA products. This type of product is characterized by low prices and low profits. Only if production yield rates are extremely high can companies ensure profits.
Therefore, when yield rates of wafer-level modules are insufficient, companies are unable to take advantage of their low-cost advantages. If the yield rate of wafer-level modules can be significantly increased in the short-term future, and if they can achieve 2MP or 3MP products, lens makers and module assembly companies will face extreme threats.
Standardization to Become Future Development Trend for CCM
Currently, mobile phone brands select exclusive camera modules for different mobile phone products. Mobile phone vendors will designate image sensor chips and lens suppliers, and customize the camera modules they need. However, following the increase in demand for mid-range and value-line mobile phone lenses and video lenses, and the pressure to make CCMs smaller, slimmer and more cost effective, standardization will be an important development for CCM.
The design focus of standardized modules is on module size, convenience of assembly, low cost and large-scale production. The emergence of wafer-level camera modules is a reflection of this need. However, as described above, if this goal is to be achieved, yield rate issues will have to be solved first.
In fact, back in 2004 Nokia promoted SMIA (Standard Mobile Imaging Architecture), benefiting standardization of module volume, small-size development, compatibility of different suppliers' products, acceleration of module development and mobile phone assembly. Nokia is still pushing this standard; all products of suppliers with which Nokia cooperates need to conform to the SMIA specifications, regardless of the resolution.
Appendix
List of Companies
Aptina |
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Digital Optics |
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Eyesquad |
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FotoNation |
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Foxonn |
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Fujinon |
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Heptagon |
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Kantatsu |
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Kolen |
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Konica Minolta |
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Largan |
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MagnaChip |
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Mitsumi |
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OV |
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Panasonic |
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Samsung |
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Samsung Tech |
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SEMCO |
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Sharp |
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Shellcase |
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Siliconfile |
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Sony |
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ST Micro |
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Tessera |
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Toshiba |
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VisEra Technologies |
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VistaPoint |
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Xintec |