Recap and Outlook for the Taiwanese Semiconductor Industry, 1Q 2024
June 07, 2024 / Cynthia Yang / Kai-An Cheng / Easan Lee
19 Page, Topical Report
US$1,800 (Single User License)


The Taiwanese semiconductor industry, encompassing IC design, IC manufacturing, and packaging and testing (also known as OSAT, Outsourced Semiconductor Assembly and Test), generated shipment value of US$33.447 billion in the fourth quarter of 2023, up 8.2% sequentially but down 1.5% year-over-year. In 2024, the growth of the IC design manufacturers will depend highly on the growth of flagship smartphones, including AI phones. Meanwhile, memory market prices have been on the rise since the first quarter of 2024, expecting to memory shipments and revenue growth for manufacturers as end-market demand gradually improves. Furthermore, the ongoing evolution of advanced packaging presents opportunities for both foundries and OSAT companies. This report examines key development issues across three major Taiwanese semiconductor sectors during the fourth quarter of 2023 and the first quarter of 2024, while also exploring major development trends expected throughout 2024. 
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