Semiconductor
Taiwanese IC Packaging & Testing Industry, 2Q 2021
June 10, 2021 / Kai-An Cheng / CATHERINE HUNG
16 Page, Statistics Report
US$1,000 (Single User License)

Abstract

The report finds that shipment value of the Taiwanese IC packaging and testing industry, or OSAT (Outsourced Semiconductor Assembly and Testing) reached US$4.9 billion in the first quarter of 2021 and registered over 3.2% sequential and 17.2% year-on-year growth. The Taiwanese industry’s growth in the first half of 2020 performed better than the same period of 2019, mainly attributed to order transfer of IDMs (Integrated Device Manufacturers) amid lockdowns worldwide. Owing to 5G commercialization, home economy due to COVID-19, and new smartphone and game console rollouts, the industry reached US$18 billion and enjoyed over 16% year-on-year growth in 2020, up from US$15.5 billion in 2019. Catering to the customers' continued demand for notebook PCs and displays, the industry is anticipated to have witnessed 5.7% sequential and 18.6% year-on-year growth in the second quarter of 2021.
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