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Taiwanese IC Packaging & Testing Industry, 2Q 2021

June 10, 2021 / Kai-An Cheng / Catherine Hung

16 Page, Statistics Report

US$1,000 (Single User License)

Abstract

The report finds that shipment value of the Taiwanese IC packaging and testing industry, or OSAT (Outsourced Semiconductor Assembly and Testing) reached US$4.9 billion in the first quarter of 2021 and registered over 3.2% sequential and 17.2% year-on-year growth. The Taiwanese industry’s growth in the first half of 2020 performed better than the same period of 2019, mainly attributed to order transfer of IDMs (Integrated Device Manufacturers) amid lockdowns worldwide. Owing to 5G commercialization, home economy due to COVID-19, and new smartphone and game console rollouts, the industry reached US$18 billion and enjoyed over 16% year-on-year growth in 2020, up from US$15.5 billion in 2019. Catering to the customers' continued demand for notebook PCs and displays, the industry is anticipated to have witnessed 5.7% sequential and 18.6% year-on-year growth in the second quarter of 2021.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2019 - 3Q 2021
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2019 - 3Q 2021
Taiwanese IC Packaging Industry Shipment Value, 1Q 2019 - 3Q 2021
Taiwanese IC Testing Industry Shipment Value, 1Q 2019 - 3Q 2021
Taiwanese IC Packaging Industry Shipment Value Rankings, 1Q 2019 - 1Q 2021
Taiwanese IC Packaging Industry Shipment Value by Vendor Tier, 1Q 2019 - 1Q 2021
Taiwanese IC Testing Industry's Shipment Value Rankings, 1Q 2019 - 1Q 2021
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2019 - 1Q 2021
Taiwanese IC Packaging Industry Shipment Value by Customer Origin, 1Q 2019 - 1Q 2021
Taiwanese IC Packaging Industry Shipment Value Share by Customer Origin, 1Q 2019 - 1Q 2021
Taiwanese IC Testing Industry Shipment Value by Customer Origin, 1Q 2019 - 1Q 2021
Taiwanese IC Testing Industry Shipment Value Share by Customer Origin, 1Q 2019 - 1Q 2021
Exchange Rate, 1Q 2019 - 1Q 2021
Research Scope & Definitions

List of Topics
This research report presents shipment value forecast of the Taiwanese OSAT (Outsourced Semiconductor Assembly and Test) industry during the first half of 2021 and recent quarter review from 1Q 2019 to 3Q 2021, and includes shipment value breakdown by customer origin from 1Q 2019 to 1Q 2021

Companies surveyed in this research are major OSAT companies in Taiwan, including ASE, PTI, KYEC, Siguard, and Ardentec.

The content of this report is based on primary data obtained from interviews and publicly available information.

Companies covered
Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, Walton

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