1.Development of TWS Headsets
1.1 Trends towards Wireless Connectivity and Smart Functions
1.2 Enhanced Bluetooth Technology and Removal of 3.5mm Jack from Smartphones Drives TWS Headset Development
1.3 Heated TWS Market Competition Pushes Leading Brands to Upgrade Services
2.Trends of the TWS Application IC Industry
2.1 Bluetooth SoC and MCU as Key Components in TWS Systems
2.2 Major Development Trends of TWS Headsets
2.2.1 Trend #1: Leading Chipmakers Develop In-house Bluetooth Solutions
2.2.2 Trend #2: Focus on Low Latency Technology 8
2.2.3 Trend #3: Bluetooth SoC with ANC Becoming a Must-have in Mid-range and High-end TWS Headsets
2.2.4 Trend #4: Noise Cancellation and Voice Assistant Boost Demand for MEMS Microphones
2.2.5 Trend #5: Increased Adoption of SiP Technology in Mid-range and High-end TWS Headsets
3.Application IC Suppliers’ Deployment in TWS Headsets
3.1 Most IC Suppliers Already Extend Reach to TWS Headsets
3.2 Leading Bluetooth IC Suppliers Tap into Chinese Customers’ Supply Chains
3.2.1 Airoha Technology’s Bluetooth Technology Favored by Chinese Customers
3.2.2 Realtek Taps into Mid-range and High-end Market Segments with Low Power Consumption Feature
3.2.3 PixArt Imaging Launches Wireless Audio SoC for Chinese Customers through Subsidiary Audiowise Technology
3.3 Majority of Taiwanese MCUs and Sensors Supplied to Chinese Brands
3. MIC Perspective
3.1 Functions and Technology of TWS Headset Application ICs Continue to Improve
3.2 Application IC Vendors Focus on China’s TWS Headset Market 17
Appendix
List of Companies