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ALL China Research Communications Computing Semiconductor Software and Consumer Electronics TAIWAN

Impact and Challenge on Semiconductor Industry under Trade Conflict between U.S. and China

November 06, 2020 / Chris Hung

24 Page, Symposium

US$1,500 (Single User License)

Abstract

Global semiconductor equipment market is still dominated by U.S., Japanese, and European brands with their proprietary processes and technologies and has relatively high barriers to enter. Pressured by U.S. semiconductor export controls, the Chinese semiconductor industry will be significantly affected. This report provides an overview of timeline of the trade conflict between the U.S. and China since 2018, analyzes the impact on semiconductor industry in China, the U.S. and Taiwan, outlines China’s possible countermeasures against the conflict, and examines possible opportunities if the conflict continues.

Table of Contents
Background of U.S. and China Trade Conflict
Impact on China’s Semiconductor Industry
Impact on U.S. and Taiwan’s Industries
China’s Possible Countermeasures against the China-U.S. Conflict
Key Industrial Challenges and Opportunities

List of Topics
Development timeline of the trade conflict between the U.S. and China during the period 2018-2020, touching on products included in the Entity List

Impact on China’s semiconductor industry, including the industry’s shipment value from 2011 to 2019 and outlining semiconductor projects developed from China’s “Big Fund” from 2014 to 2018 as well as semiconductor clusters in China

Impact of U.S. ban on Huawei’s chips, smartphones, and 5G base stations

Development of the global semiconductor industry, touching on how major IT brands have reacted such as Google, Qualcomm, Intel, and AMD following the Huawei Ban.

China’s possible countermeasures against the conflict, touching on its development of emerging applications ICs, a homegrown semiconductor industry, and China Standards 2035

Outline of key industrial challenges and opportunities if the conflict continues.

Companies covered
Advanced Micro, Advantest, AMD, AMEC, Analogix Semiconductor, Apex Microelectronics, Apple, ASM Pacific, ASML, BD Star Navigation, Beijing Cengol, Beijing Yandong Microelectronic, Centec Networks, Changsha Jingjia , icroelectronics ,China Wafer Level CSP, CR Microelectronics, Dynex Semiconductor, Enkris Semiconductor, Fujitsu Microelectronics, GigaDevice, Global Power Technology, Goodix, Google, Guoke Micro, Hangzhou Chang, Hangzhou Chang Chuan Tech, Hangzhou Silan, Hisilicon, Hitachi High-tech, Hua Hong Semiconductor, Hua Hong Semiconductor, Huawei, Innoscience, Intel, JCET Jiangsu Yoke Technology, Juhua Technology, KLA, Lam Research, Li-On, MediaTek, Nantong Fujitsu Microelectronics, Naura Technology, Navtech Radar Qromis, Qualcomm, San’an Optoelectronics, Sanechips Technology, Screen, Semiconductor Manufacturing North China, SevenStar Electronics, Shanghai Huahong Grace Semiconductor Manufacturing, Shanghai Huali Microelectronics, Shenyang Piotech, SJSemi, SMEE, SMIC, Spreadtrum Communications, STMicroelectronics, TEL, Teradyne, Tianshui Huatian, TSMC, UniCompound, VeriSilicon, VIS, Yangjie Electronics, Yangtze Memory, ZTE

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