Taiwanese IC Packaging & Testing Industry, 2Q 2020
July 16, 2020 / Angela Huang
18 Page, Statistics Report
US$1,000 (Single User License)


The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over US$ 4.21 billion in the first quarter of 2020, down 2.7% sequentially but up a whopping 24.9% year-on-year. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications and products become major growth drivers to bolster the demand for high-end wafer-level OSAT (Outsourced Semiconductor Assembly and Testing) service. Shipment value of the industry is expected to have grown 15.9% year-on-year and 0.7% sequentially, reaching US$4.24 billion in the second quarter of 2020. The double-digit year-on-year growth in the first and second quarters of 2020 was mainly attributed to the relatively low shipment performance in the first half of 2019. The US-China trade war kicked off in the second half of 2018, during which some downstream companies made earlier inventory replenishments to reduce the impact of increased tariffs, thereby affecting the shipments in the first half of 2019.  
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