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Taiwanese IC Packaging & Testing Industry, 2Q 2020

July 16, 2020 / Angela Huang

18 Page, Statistics Report

US$1,000 (Single User License)

Abstract

The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over US$ 4.21 billion in the first quarter of 2020, down 2.7% sequentially but up a whopping 24.9% year-on-year. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications and products become major growth drivers to bolster the demand for high-end wafer-level OSAT (Outsourced Semiconductor Assembly and Testing) service. Shipment value of the industry is expected to have grown 15.9% year-on-year and 0.7% sequentially, reaching US$4.24 billion in the second quarter of 2020. The double-digit year-on-year growth in the first and second quarters of 2020 was mainly attributed to the relatively low shipment performance in the first half of 2019. The US-China trade war kicked off in the second half of 2018, during which some downstream companies made earlier inventory replenishments to reduce the impact of increased tariffs, thereby affecting the shipments in the first half of 2019.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2018 - 3Q 2020
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2018 - 3Q 2020
Taiwanese IC Packaging Industry Shipment Value, 1Q 2018 - 3Q 2020
Taiwanese IC Testing Industry Shipment Value, 1Q 2018 - 3Q 2020
Taiwanese IC Packaging Industry Shipment Value Rankings, 1Q 2018 - 1Q 2020
Taiwanese IC Packaging Industry Shipment Value by Vendor Tier, 1Q 2018 - 1Q 2020
Taiwanese IC Testing Industry's Shipment Value Rankings, 1Q 2018 - 1Q 2020
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2018 - 1Q 2020
Taiwanese IC Packaging Industry Shipment Value by Customer Origin, 1Q 2018 - 1Q 2020
Taiwanese IC Packaging Industry Shipment Value Share by Customer Origin, 1Q 2018 - 1Q 2020
Taiwanese IC Testing Industry Shipment Value by Customer Origin, 1Q 2018 - 1Q 2020
Taiwanese IC Testing Industry Shipment Value Share by Customer Origin, 1Q 2018 - 1Q 2020
Exchange Rate, 1Q 2018 - 1Q 2020
Research Scope & Definitions

List of Topics
This research report presents shipment value forecast and recent quarter review of the Taiwanese OSAT (Outsourced Semiconductor Assembly and Test) industry from 1Q18-3Q20 and includes breakdown of customer origin.

Companies surveyed in this research are major OSAT companies in Taiwan, including ASE, PTI, KYEC, Siguard, and Ardentec.

The content of this report is based on primary data obtained from interviews and publicly available information.

Companies covered
Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton

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