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ALL China Research Communications Computing Semiconductor Software and Consumer Electronics TAIWAN

Taiwanese IC Packaging & Testing Industry, 1Q 2020

June 03, 2020 / Angela Huang

18 Page, Statistics Report

US$1,000 (Single User License)

Abstract

The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.33 billion in the fourth of 2019, up 4.3% sequentially and 10.6% year-on-year. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications and products become major growth drivers to bolster the demand for high-end wafer-level packaging service. Shipment value of the industry is expected to have grown 18.8% year-on-year but declined 7.5% sequentially, reaching USD4.0 billion in the first quarter of 2020. The decline is mainly attributed to the seasonal cycle of the industry and the reduced working days due to COVID-19 pandemic.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2018 - 2Q 2020
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2018 - 2Q 2020
Taiwanese IC Packaging Industry Shipment Value, 1Q 2018 - 2Q 2020
Taiwanese IC Testing Industry Shipment Value, 1Q 2018 - 2Q 2020
Taiwanese IC Packaging Industry Shipment Value Rankings, 1Q 2018 - 4Q 2019
Taiwanese IC Packaging Industry Shipment Value by Vendor Tier, 1Q 2018 - 4Q 2019
Taiwanese IC Testing Industry's Shipment Value Rankings, 1Q 2018 - 4Q 2019
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2018 - 4Q 2019
Taiwanese IC Packaging Industry Shipment Value by Customer Origin, 1Q 2018 - 4Q 2019
Taiwanese IC Packaging Industry Shipment Value Share by Customer Origin, 1Q 2018 - 4Q 2019
Taiwanese IC Testing Industry Shipment Value by Customer Origin, 1Q 2018 - 4Q 2019
Taiwanese IC Testing Industry Shipment Value Share by Customer Origin, 1Q 2018 - 4Q 2019
Exchange Rate, 1Q 2018 - 4Q 2019
Research Scope & Definitions

List of Topics
This research report presents shipment value forecast and recent quarter review of the Taiwanese OSAT (Outsourced Semiconductor Assembly and Test) industry from 1Q18-2Q20 and includes breakdown of customer origin.

Companies surveyed in this research are major OSAT companies in Taiwan, including ASE, PTI, KYEC, Siguard, and Ardentec.

The content of this report is based on primary data obtained from interviews and publicly available information.

Companies covered
Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton

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