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Taiwanese IC Packaging & Testing Industry, 3Q 2019

November 28, 2019 / Wen Liu

18 Page, Statistics Report

US$1,000 (Single User License)

Abstract

The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 3.37 billion in the second first quarter of 2019, up 8.5% sequentially. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to continue on the growth trajectory. Although the industry is anticipated to have seen a pickup in shipment value in the second half of 2019, the industry’s shipment value is projected to witness a slight year-on-year decline in 2019 compared to 2018.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2017 - 4Q 2019
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2017 - 4Q 2019
Taiwanese IC Packaging Industry Shipment Value, 1Q 2017 - 4Q 2019
Taiwanese IC Testing Industry Shipment Value, 1Q 2017 - 4Q 2019
Taiwanese IC Packaging Industry Shipment Value Rankings, 1Q 2017 - 2Q 2019
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 1Q 2017 - 2Q 2019
Taiwanese IC Testing Industry’s Shipment Value Rankings, 1Q 2017 - 2Q 2019
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2017 - 2Q 2019
Taiwanese IC Packaging Industry Shipment Value by Customers' Origin, 1Q 2017 - 2Q 2019
Taiwanese IC Packaging Industry Shipment Value Share by Customers' Origin, 1Q 2017 - 2Q 2019
Taiwanese IC Testing Industry Shipment Value by Customers' Origin, 1Q 2017 - 2Q 2019
Taiwanese IC Testing Industry Shipment Value Share by Customers' Origin, 1Q 2017 - 2Q 2019
Exchange Rate, 1Q 2017 - 2Q 2019
Research Scope & Definitions

List of Topics
This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.

Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.

Companies covered
Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton

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