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Semiconductor

Taiwanese IC Packaging & Testing Industry, 2Q 2019

June 20, 2019 / Wen Liu

18 Page, Statistics Report

US$1,000 (Single User License)

Abstract

This report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 3.4 billion in the first quarter of 2019, down both year-on-year and sequentially. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to have grown about 8% in 2018 compared to 2017. Amid the slowdown in shipment growth in the first quarter of 2019, the industry is anticipated to have seen a modest pickup in shipments in the second quarter of 2019.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 2Q 2016 - 3Q 2019
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 2Q 2016 - 3Q 2019
Taiwanese IC Packaging Industry Shipment Value , 2Q 2016 -3Q 2019
Taiwanese IC Testing Industry Shipment Value , 2Q 2016 - 3Q 2019
Taiwanese IC Packaging Industry Shipment Value Rankings, 2Q 2016 - 1Q 2019
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 2Q 2016 - 1Q 2019
Taiwanese IC Testing Industry’s Shipment Value Rankings, 2Q 2016 - 1Q 2019
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 2Q 2016 - 1Q 2019
Taiwanese IC Packaging Industry Shipment Value by Customer Origin, 2Q 2016 - 1Q 2019
Taiwanese IC Packaging Industry Shipment Value Share by Customer Origin, 2Q 2016 - 1Q 2019
Taiwanese IC Testing Industry Shipment Value by Customers' Origin, 2Q 2016 - 1Q 2019
Taiwanese IC Testing Industry Shipment Value Share by Customers' Origin, 2Q 2016 - 1Q 2019
Exchange Rate, 2Q 2016 - 4Q 2018
Research Scope & Definitions

List of Topics
This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.

Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.

The content of this report is based on primary data obtained from interviews, and publicly available information.

Companies covered
Arima, Compal, Foxconn, HTC, IAC, Inventec, Pegatron, Qisda, Wistron

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