Taiwanese IC Packaging & Testing Industry, 1Q 2019
April 24, 2019 / Wen Liu
18 Page, Statistics Report
US$1,000 (Single User License)


The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived at USD 3.9 billion in the fourth quarter of 2018, up year-on-year but down sequentially. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to have grown about 8% in 2018 compared to 2017. Amid the slowdown in shipment growth in the first quarter of 2019, the industry is anticipated to show a modest pickup in shipment growth in the second quarter of 2019.
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