The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.1 billion in the third quarter of 2018, up both year-on-year and sequentially. The growth is mainly attributed to the strong shipments of memory ICs. The industry is forecast to have enjoyed both year-on-year and sequential growth in the fourth quarter. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand and thus the industry is anticipated to have grown about 11% year-on-year in 2018.