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Taiwanese IC Packaging & Testing Industry, 3Q 2018

October 11, 2018 / Wen Liu

15 Page, Statistics Report

US$1,000 (Single User License)

Abstract

The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 3.9 billion in the second quarter of 2018, up both year-on-year and sequentially. The growth is mainly attributed to the strong shipments of memory ICs and the better than expected shipments for smartphones. The industry is forecast to have enjoyed both year-on-year and sequential growth in the third quarter, traditionally the peak season. While the demand for smartphones is likely to sustain, HPC (High Performance Computing) and AI applications are to become major growth drivers to push up high-end wafer-level packaging demand and thus the industry is anticipated to have about 8% year-on-year growth this year.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2016 - 4Q 2018
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2016 - 4Q 2018
Taiwanese IC Packaging Industry Shipment Value, 1Q 2016 - 4Q 2018
Taiwanese IC Testing Industry Shipment Value, 1Q 2016 - 4Q 2018
Taiwanese IC Packaging Industry Shipment Value Rankings, 1Q 2016 - 2Q 2018
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 1Q 2016 - 2Q 2018
Taiwanese IC Testing Industry Shipment Value Rankings, 1Q 2016 - 2Q 2018
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2016 - 2Q 2018
Taiwanese IC Packaging Industry Shipment Value by Customers' Origin, 1Q 2016 - 2Q 2018
Taiwanese IC Packaging Industry Shipment Value Share by Customers' Origin, 1Q 2016 - 2Q 2018
Taiwanese IC Testing Industry Shipment Value by Customers' Origin, 1Q 2016 - 2Q 2018
Taiwanese IC Testing Industry Shipment Value Share by Customers' Origin, 1Q 2016 - 2Q 2018
Exchange Rate, 1Q 2016 - 2Q 2018
Research Scope & Definitions

List of Topics
This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.

Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.

The content of this report is based on primary data obtained from interviews, and publicly available information.

Companies covered
Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton

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