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Taiwanese IC Packaging & Testing Industry, 2Q 2018

June 21, 2018 / Wen Liu

15 Page, Statistics Report

US$1,000 (Single User License)

Abstract

The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived at USD 3.6 billion in the first quarter of 2018, up year-on-year but down sequentially. The sequential decline was attributed mainly to the weak seasonal effect and quarter-end inventory clearance at upstream. The industry is forecast to enjoy both year-on-year and sequential growth in the second quarter of 2018. While smartphone demand is slowing down, HPC (High Performance Computing) and AI applications are to become major growth drivers to push up high-end wafer-level packaging demand and thus the industry is anticipated to maintain slight growth this year.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2016 - 3Q 2018
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2016 - 3Q 2018
Taiwanese IC Packaging Industry Shipment Value, 1Q 2016 - 3Q 2018
Taiwanese IC Testing Industry Shipment Value, 1Q 2016 - 3Q 2018
Taiwanese IC Packaging Industry Shipment Value Rankings, 1Q 2016 - 1Q 2018
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 1Q 2016 - 1Q 2018
Taiwanese IC Testing Industry Shipment Value Rankings, 1Q 2016 - 1Q 2018
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2016 - 1Q 2018
Taiwanese IC Packaging Industry Shipment Value by Customers' Origin, 1Q 2016 - 1Q 2018
Taiwanese IC Packaging Industry Shipment Value Share by Customers' Origin, 1Q 2016 - 1Q 2018
Taiwanese IC Testing Industry Shipment Value by Customers' Origin, 1Q 2016 - 1Q 2018
Taiwanese IC Testing Industry Shipment Value Share by Customers' Origin, 1Q 2016 - 1Q 2018
Exchange Rate, 1Q 2016 - 1Q 2018
Research Scope & Definitions

List of Topics

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.

Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.

The content of this report is based on primary data obtained from interviews, and publicly available information.

Companies covered
Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton

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