MIC ENGLISH

Report Categories

ALL China Research Communications Computing Semiconductor Software and Consumer Electronics TAIWAN

Semiconductor

Taiwanese IC Packaging & Testing Industry, 4Q 2016

January 20, 2017 / Bear Hsiung

15 Page, Statistics Report

US$600 (Single User License)

Abstract

The report finds that shipment value of the Taiwanese IC packaging and testing industry grew 10.4% sequentially to approximately US$3.5 billion in the third quarter of 2016, thanks to the growing demand for chips used in IoT microcontrollers, smart car sensors, and graphic cards, virtual reality headsets, and wearable devices. The industry's shipment value is expected to have grown 2.5% sequentially and 16.3% year-on-year in the fourth quarter fo 2016.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 2Q 2014 - 1Q 2017

Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 2Q 2014 - 1Q 2017

Taiwanese IC Packaging Industry Shipment Value , 2Q 2014 - 1Q 2017

Taiwanese IC Testing Industry Shipment Value , 2Q 2014 - 1Q 2017

Taiwanese IC Packaging Industry's Shipment Value Rankings, 2Q 2014 - 3Q 2016

Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 2Q 2014 - 3Q 2016

Taiwanese IC Testing Industry's Shipment Value Rankings, 2Q 2014 - 3Q 2016

Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 2Q 2014 - 3Q 2016

Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 2Q 2014 - 3Q 2016

Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 2Q 2014 - 3Q 2016

Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 2Q 2014 - 3Q 2016

Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 2Q 2014 - 3Q 2016

Exchange Rate, 2Q 2014 - 3Q 2016

Research Scope & Definitions

List of Topics
This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.
Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained from interviews, and publicly available information such as corporate financial statements.

Companies covered
Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton

Recommended Research Reports

Consumer Brain-Computer Interface: Market and Product Development Trends (pre-order)
Coupang's Cross-border Pivot: Navigating Strategies in Taiwan Following Its Exit from Japan
Leading Mobile Payment Providers and Their Cross-Border Financial Services: Ant Group, Paysend, and Nium (pre-order)
Green Strategic Thinking of PC Brands From The Perspective of Product Lifecycle Stages (pre-order)
Product Development and Supply Chain Deployment of Leading Chinese Automotive Battery Supplier: CATL (pre-order)

To get MIC's complete insight, please log in.