MIC ENGLISH

Report Categories

ALL China Research Communications Computing Semiconductor Software and Consumer Electronics TAIWAN

Semiconductor

Taiwanese IC Packaging & Testing Industry, 1Q 2014

March 19, 2014 / Chung-Yu Yang

14 Page, Statistics Report

US$800 (Single User License)

Abstract

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements. The report finds that, after continuous expansion in two quarters in a row, shipment value of the Taiwanese IC packaging and testing industry saw a slight sequential decline in the fourth quarter of 2013. The downturn is expected to continue well into the first quarter of 2014, before a bounce-back being anticipated in the second quarter.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 3Q 2011 - 2Q 2014 　
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 3Q 2011 - 2Q 2014
Taiwanese IC Packaging Industry Shipment Value , 3Q 2011 - 2Q 2014 　
Taiwanese IC Testing Industry Shipment Value , 3Q 2011 - 2Q 2014 　
Taiwanese IC Packaging Industry's Shipment Value Rankings, 3Q 2011 - 4Q 2013 　
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 3Q 2011 - 4Q 2013
Taiwanese IC Testing Industry's Shipment Value Rankings, 3Q 2011 - 4Q 2013 　
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 3Q 2011 - 4Q 2013
Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 3Q 2011 - 4Q 2013 　
Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 3Q 2011 - 4Q 2013
Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 3Q 2011 - 4Q 2013 　
Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 3Q 2011 - 4Q 2013
Exchange Rate, 3Q 2010 - 4Q 2013 　
Research Scope & Definitions

Companies covered
Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton

Recommended Research Reports

Global Private 5G Network Market Trends and Insights into Taiwanese Deployments
Global Smart Cockpit Development Trends and Analysis of Taiwan's Industry Landscape (pre-order)
Global Opportunities in the Development of LEO Satellite Ground Equipment (pre-order)
Lighthouse Factories and Networks: Best Practices from Foxconn, Haier, and Midea Groups (pre-order)
B5G Technology Trends in the Taiwanese Networking Industry: Focus on Open RAN and Private Networks

To get MIC's complete insight, please log in.