1. Analysis of Key Issues
1.1 IC Design
1.1.1 IC Design Industry Rebounds from High Inventory Shadow but Seasonal Cycle Yet to Fully Recover
1.1.2 Smartphone Supply Chain Replenishment Boosts Small Display Driver ICs; AMOLED Prices Competitive
1.2 IC Manufacturing
1.2.1 Advanced Process Technology Drives Over 60% Revenue; 8” Wafer Capacity Utilization Keeps Declining
1.2.2 Mainstream Memory Market Shows Signs of Recovery; Niche DRAM Demand Rises
1.3 IC Packaging and Testing
1.3.1 IC Packaging and Testing Industry Remains Cautious Despite Suring Short and Urgent Orders for PC and Smartphone Chips
1.3.2 Memory Inventory Clearance Nearing Completion, Driving Growth in Memory Packaging and Testing
2. Industry Outlook
2.1 IC Design
2.1.1 Smartphone Supply Chain Replenishment Momentum Persists, Yet Recovery in Inventory Rebuilding Remains Uncertain
2.1.2 IC Design Companies to Continuously Benefit from Expansion of AI Applications and Trend of ASIC Outsourcing
2.2 IC Manufacturing
2.2.1 First-Quarter Revenue Outlook for Semiconductor Wafer Foundries Conservative as 2024 Market Demand Slowly Recovers
2.2.2 Memory Market Warming Up, Operations Expected to Improve Quarterly
2.3 IC Packaging and Testing
2.3.1 Rising Demand for Emerging Applications Drives Major OSAT Companies to Increase Production Capacity and CapEx
2.3.2 Advanced Packaging Gaining Importance, Leading OSAT Companies to Invest More in Advanced Packaging Technology and Capacity
Appendix
List of Companies