1.Key Issues in 4Q 2020 
1.1 IC Design 
1.1.1 Other Chinese Brands Increase Chip Inventories as Huawei Faces Setback, Driving up IC Design Houses’ Revenues 
1.1.2 Small IC Design Houses Affected by Crowding Out Effect amid High ICT Chip Demand 
1.2 Semiconductor Manufacturing 
1.2.1 Production of Mature Nodes Reaches Full Capacity Due to Transfer of Orders Caused by the U.S.-China Trade War 
1.2.2 Share of Revenues from Advanced Nodes Rises Dramatically as Mass Production of 5nm Chips Begins 
1.3 OSAT 
1.3.1 Orders from Other Chinese Brands Push OSAT Companies to Full Capacity 
1.3.2 Worsening Material Shortages Affect OSAT Companies’ Capacity 
2.Industry Development in 1Q 2021 
2.1 IC Design 
2.1.1 Taiwanese Smartphone Suppliers Overwhelmed by Surging Smartphone Orders 
2.1.2 The IC Shortage Likely to Continue into 2H21 Due to Crowding out Effect Caused by Urgent Auto Chip Orders 
2.2 Semiconductor Manufacturing 
2.2.1 The Automotive IC Shortage Increases Extra Pressure on Semiconductor Manufacturing Capacity 
2.2.2 Semiconductor Chips Become Strategic Resources; IC Production Capacity Becomes New Variable in the U.S.-China Trade War 
2.3 OSAT 
2.3.1 The ABF Substrate Shortage Still a Big Issue for OSAT Companies 
2.3.2 OSAT Companies’ Profits Expected to Grow Steadily as Shortages Continue
Appendix 
List of Companies 

Key developments and issues in three subsectors of the Taiwanese semiconductor industry in fourth quarter of 2020, including IC design, manufacturing, and OSAT (Outsourced Semiconductor Assembly and Test)

Key developments of the Taiwanese semiconductor industry in the first quarter of 2021 by subsector, touching on the strategies of major players in each subsector