1.Key Issues 
1.1 IC Design 
1.1.1 Rosy Outlook for Notebook PC Market on Seasonal Demand for Commercial Models and Slowdown in Global Outbreak 
1.1.2 Network Communication Chips in Shortest Supply with Lead Times up to 1 Year; RF IC Suppliers Experience Declining Profits 
1.2 Semiconductor Manufacturing 
1.2.1 TSMC’s Price Hikes Caught World’s Attention 
1.2.2 Niche-market Applications Drive Memory Vendors’ Revenues 
1.3 OSAT (Outsourced Semiconductor Assembly & Test) 
1.3.1 COVID-19 Outbreaks in Southeast Asia Hit the OSAT Industry Hard 
1.3.2 Peak Season Effect Drives Revenue Growth, Yet Some Vendors’ Revenues Yet to Meet Expectations 
2.Industry Outlook 
2.1 IC Design 
2.1.1 Driver IC Suppliers’ Shipments to Rise Slightly as Large-size TV Panel Demand Likely to Recover from Rock Bottom 
2.1.2 Forecast for Off-season Demand Revised Downward amid Supply Shortages and Tight Production Capacity but to Slowly Recover in 1Q22 
2.2 Semiconductor Manufacturing 
2.2.1 Wafer Foundries Aggressively Expand Production Capacity with 28nm Becoming Increasingly Important 
2.3 OSAT 
2.3.1 Declining End Market Demand and Inventory Adjustment to Affect Revenue Growth 
2.3.2 China’s Dual Control of Energy Policy Likely to Affect Semiconductor Supply Chains 
Appendix 
List of Companies 
 

Development and key issues in the Taiwanese semiconductor industry, comprising of IC design, semiconductor manufacturing, and packaging and testing (also known as OSAT, Outsourced Semiconductor Assembly and Test)

Outlook for the industry, comprising of IC design, semiconductor manufacturing, and packaging and testing (also known as OSAT, Outsourced Semiconductor Assembly and Test)