1.Development of TWS
1.1 Trends towards Wireless Connectivity and Smart Functions
1.2 Enhanced Bluetooth Technology and Removal of 3.5mm Jack from Smartphones Drives TWS Development
1.3 Heated TWS Market Competition Pushes Leading Brands to Upgrade Services
2.Trends of the TWS Application IC Industry
2.1 Bluetooth SoC and MCU as Key Components in TWS Systems
2.2 Major Development Trends of TWS
2.2.1 Trend #1: Leading Chipmakers Develop In-house Bluetooth Solutions
2.2.2 Trend #2: Focus on Low Latency Technology
2.2.3 Trend #3: Bluetooth SoC with ANC Becoming a Must-have in Mid-range and High-end TWS
2.2.4 Trend #4: Noise Cancellation and Voice Assistant Boost Demand for MEMS Microphones
2.2.5 Trend #5: Increased Adoption of SiP Technology in Mid-range and High-end TWS
3.Application IC Suppliers’ Deployment in TWS
3.1 Most IC Suppliers Already Extend Reach to TWS
3.2 Leading Bluetooth IC Suppliers Tap into Chinese Customers’ Supply Chains
3.2.1 Airoha Technology’s Bluetooth Technology Favored by Chinese Customers
3.2.2 Realtek Taps into Mid-range and High-end Market Segments with Low Power Consumption Feature
3.2.3 PixArt Imaging Launches Wireless Audio SoC for Chinese Customers through Subsidiary Audiowise Technology
3.3 Majority of Taiwanese MCUs and Sensors Supplied to Chinese Brands
3. MIC Perspective
Appendix
List of Companies