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Semiconductor

Taiwanese IC Packaging & Testing Industry, 4Q 2020

January 12, 2021 / Angela Huang

18 Page, Statistics Report

US$1,000 (Single User License)

Abstract

The report finds that shipment value of the Taiwanese IC packaging and testing industry, or OSAT (Outsourced Semiconductor Assembly and Testing) reached US$ 4.58 billion in the third quarter of 2020, up 4.6% sequentially and 10.5% year-on-year. The Taiwanese industry’s growth in the first half of 2020 performed better than the same period of 2019 and was mainly attributed to order shifts from IDMs (Integrated Device Manufacturers) due to city lockdowns worldwide. Despite the cooling demand in the consumer market, the industry is expected to have continued growth throughout 2020, mainly owing to 5G commercialization, home economy due to COVID-19, and new smartphone and game console rollouts.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 2Q 2018 - 1Q 2021
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 2Q 2018 - 1Q 2021
Taiwanese IC Packaging Industry Shipment Value, 2Q 2018 - 1Q 2021
Taiwanese IC Testing Industry Shipment Value, 2Q 2018 - 1Q 2021
Taiwanese IC Packaging Industry Shipment Value Rankings, 2Q 2018 - 3Q 2020
Taiwanese IC Packaging Industry Shipment Value by Vendor Tier, 2Q 2018 - 3Q 2020
Taiwanese IC Testing Industry's Shipment Value Rankings, 2Q 2018 - 3Q 2020
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 2Q 2018 - 3Q 2020
Taiwanese IC Packaging Industry Shipment Value by Customer Origin, 2Q 2018 - 3Q 2020
Taiwanese IC Packaging Industry Shipment Value Share by Customer Origin, 2Q 2018 - 3Q 2020
Taiwanese IC Testing Industry Shipment Value by Customer Origin, 2Q 2018 - 3Q 2020
Taiwanese IC Testing Industry Shipment Value Share by Customer Origin, 2Q 2018 - 3Q 2020
Exchange Rate, 2Q 2018 - 3Q 2020
Research Scope & Definitions

List of Topics
This research report presents shipment value forecast and recent quarter review of the Taiwanese OSAT (Outsourced Semiconductor Assembly and Test) industry from 2Q18-4Q20 and includes breakdown of customer origin.

Companies surveyed in this research are major OSAT companies in Taiwan, including ASE, PTI, KYEC, Siguard, and Ardentec.

The content of this report is based on primary data obtained from interviews and publicly available information.

Companies covered
Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, Walton

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