Companies covered AMD, Amkor, Apple, ASE, ASML, Asus, Beijing Horizon Robotics Technology, Beijing International Space Science Institute, Beijing Smartchip Microelectronics, Bitfily, Bitmain, Broadcom, Cambrian, Canaan Creative, China Electronics Corporation, Chipbond, ChipMOS, DeePhi Technology, Elite, FCI, Fujitsu Semiconductor, GalaxyCore, Giga Solution, Global Unichip, GlobalFoundries, Huahong Semiconductor, Hijian Technology Corporation, Hikvision, Himax, HiSilicon, Huahong Semiconductor, Huawei, Huiding Technology, Hynix, Intel, J-Device, JECT, JHICC, JSCK, KYEC, Marvell, MediaTek, Mie Fujitsu Semiconductor, Nanium, Nokia, Novatek, Microelectronics, NVidia, OmniVision, On Semiconductor, OnePlus, Oppo, Panasonic, Panasonic Semiconductor, Phison, Powerchip, PTI, Qorvo, Qualcomm, Raydium, Realtek, Rockchip, Samsung, Sigurd, Silicon Motion, Sitronix, SJSemi, Skyworks, SMIC, SPIL, STATS ChipPAC, Tainshui Huatian Technology, Tera Probe, Tongu Microelectronics, TowerJazz, TSI, Tsinghua Unigroup, TSMC, UMC, Unisem, Unisoc, UTAC, VIS, Vivo, Winstek, Xiaomi, Xilinx, Zhejiang Dahua, ZTE Microelectronics