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Semiconductor

Taiwanese IC Packaging & Testing Industry, 1Q 2017

March 09, 2017 / Bear Hsiung

16 Page, Statistics Report

US$600 (Single User License)

Abstract

The report finds that shipment value of the Taiwanese IC packaging and testing industry continued to grow sequentially and year-on-year to approximately US$3.55 billion in the fourth quarter of 2016. This was mainly attributed to growing demand for chips found in variety of applications such as IoT microcontrollers, smart car sensors, and graphic cards, virtual reality headsets, and wearable devices. With shipment value of USD 13.0 billion, Taiwan's global share is estaimated at 53.6%, making it the world's largest fabless IC industry.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 3Q 2014 - 2Q 2017

Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 3Q 2014 - 2Q 2017

Taiwanese IC Packaging Industry Shipment Value , 3Q 2014 - 2Q 2017

Taiwanese IC Testing Industry Shipment Value , 3Q 2014 - 2Q 2017

Taiwanese IC Packaging Industry's Shipment Value Rankings, 3Q 2014 - 4Q 2016

Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 3Q 2014 - 4Q 2016

Taiwanese IC Testing Industry's Shipment Value Rankings, 3Q 2014 - 4Q 2016

Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 3Q 2014 - 4Q 2016

Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 3Q 2014 - 4Q 2016

Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 3Q 2014 - 4Q 2016

Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 3Q 2014 - 4Q 2016

Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 3Q 2014 - 4Q 2016

Exchange Rate, 3Q 2014 - 4Q 2016

Research Scope & Definitions

List of Topics
This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.

Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.
The content of this report is based on primary data obtained from interviews, and publicly available information.

Companies covered
Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton

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