MIC ENGLISH

Report Categories

ALL China Research Communications Computing Semiconductor Software and Consumer Electronics TAIWAN

Semiconductor

Taiwanese IC Packaging & Testing Industry, 1Q 2016

March 03, 2016 / Hui-Chung, Tu

16 Page, Statistics Report

US$600 (Single User License)

Abstract

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements. The report found that shipment value of the Taiwanese IC packaging and testing industry inched down to US$3.09 billion in the fourth quarter of 2015, down 0.4% sequentially and 10.1% year on year. The industry's shipment value is projected to slip further to US$2.96 billion in the first quarter of 2016.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 3Q 2013 - 2Q 2016
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 3Q 2013 - 2Q 2016
Taiwanese IC Packaging Industry Shipment Value , 3Q 2013 - 2Q 2016
Taiwanese IC Testing Industry Shipment Value , 3Q 2013 - 2Q 2016
Taiwanese IC Packaging Industry's Shipment Value Rankings, 3Q 2013 -4Q 2015
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 3Q 2013 - 4Q 2015
Taiwanese IC Testing Industry's Shipment Value Rankings, 3Q 2013 - 4Q 2015
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 3Q 2013 - 4Q 2015
Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 3Q 2013 - 4Q 2015
Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 3Q 2013 - 4Q 2015
Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 3Q 2013 - 4Q 2015
Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 3Q 2013 - 4Q 2015
Exchange Rate, 3Q 2013 - 4Q 2015
Research Scope & Definitions

Companies covered
Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton

Recommended Research Reports

Global Private 5G Network Market Trends and Insights into Taiwanese Deployments
Global Smart Cockpit Development Trends and Analysis of Taiwan's Industry Landscape (pre-order)
Global Opportunities in the Development of LEO Satellite Ground Equipment (pre-order)
Lighthouse Factories and Networks: Best Practices from Foxconn, Haier, and Midea Groups (pre-order)
B5G Technology Trends in the Taiwanese Networking Industry: Focus on Open RAN and Private Networks

To get MIC's complete insight, please log in.